1/* 2 * Generic EDAC defs 3 * 4 * Author: Dave Jiang <djiang@mvista.com> 5 * 6 * 2006-2008 (c) MontaVista Software, Inc. This file is licensed under 7 * the terms of the GNU General Public License version 2. This program 8 * is licensed "as is" without any warranty of any kind, whether express 9 * or implied. 10 * 11 */ 12#ifndef _LINUX_EDAC_H_ 13#define _LINUX_EDAC_H_ 14 15#include <linux/atomic.h> 16#include <linux/kobject.h> 17#include <linux/completion.h> 18#include <linux/workqueue.h> 19 20struct device; 21 22#define EDAC_OPSTATE_INVAL -1 23#define EDAC_OPSTATE_POLL 0 24#define EDAC_OPSTATE_NMI 1 25#define EDAC_OPSTATE_INT 2 26 27extern int edac_op_state; 28extern int edac_err_assert; 29extern atomic_t edac_handlers; 30extern struct bus_type edac_subsys; 31 32extern int edac_handler_set(void); 33extern void edac_atomic_assert_error(void); 34extern struct bus_type *edac_get_sysfs_subsys(void); 35extern void edac_put_sysfs_subsys(void); 36 37static inline void opstate_init(void) 38{ 39 switch (edac_op_state) { 40 case EDAC_OPSTATE_POLL: 41 case EDAC_OPSTATE_NMI: 42 break; 43 default: 44 edac_op_state = EDAC_OPSTATE_POLL; 45 } 46 return; 47} 48 49#define EDAC_MC_LABEL_LEN 31 50#define MC_PROC_NAME_MAX_LEN 7 51 52/* memory devices */ 53enum dev_type { 54 DEV_UNKNOWN = 0, 55 DEV_X1, 56 DEV_X2, 57 DEV_X4, 58 DEV_X8, 59 DEV_X16, 60 DEV_X32, /* Do these parts exist? */ 61 DEV_X64 /* Do these parts exist? */ 62}; 63 64#define DEV_FLAG_UNKNOWN BIT(DEV_UNKNOWN) 65#define DEV_FLAG_X1 BIT(DEV_X1) 66#define DEV_FLAG_X2 BIT(DEV_X2) 67#define DEV_FLAG_X4 BIT(DEV_X4) 68#define DEV_FLAG_X8 BIT(DEV_X8) 69#define DEV_FLAG_X16 BIT(DEV_X16) 70#define DEV_FLAG_X32 BIT(DEV_X32) 71#define DEV_FLAG_X64 BIT(DEV_X64) 72 73/** 74 * enum hw_event_mc_err_type - type of the detected error 75 * 76 * @HW_EVENT_ERR_CORRECTED: Corrected Error - Indicates that an ECC 77 * corrected error was detected 78 * @HW_EVENT_ERR_UNCORRECTED: Uncorrected Error - Indicates an error that 79 * can't be corrected by ECC, but it is not 80 * fatal (maybe it is on an unused memory area, 81 * or the memory controller could recover from 82 * it for example, by re-trying the operation). 83 * @HW_EVENT_ERR_FATAL: Fatal Error - Uncorrected error that could not 84 * be recovered. 85 */ 86enum hw_event_mc_err_type { 87 HW_EVENT_ERR_CORRECTED, 88 HW_EVENT_ERR_UNCORRECTED, 89 HW_EVENT_ERR_FATAL, 90}; 91 92/** 93 * enum mem_type - memory types. For a more detailed reference, please see 94 * http://en.wikipedia.org/wiki/DRAM 95 * 96 * @MEM_EMPTY Empty csrow 97 * @MEM_RESERVED: Reserved csrow type 98 * @MEM_UNKNOWN: Unknown csrow type 99 * @MEM_FPM: FPM - Fast Page Mode, used on systems up to 1995. 100 * @MEM_EDO: EDO - Extended data out, used on systems up to 1998. 101 * @MEM_BEDO: BEDO - Burst Extended data out, an EDO variant. 102 * @MEM_SDR: SDR - Single data rate SDRAM 103 * http://en.wikipedia.org/wiki/Synchronous_dynamic_random-access_memory 104 * They use 3 pins for chip select: Pins 0 and 2 are 105 * for rank 0; pins 1 and 3 are for rank 1, if the memory 106 * is dual-rank. 107 * @MEM_RDR: Registered SDR SDRAM 108 * @MEM_DDR: Double data rate SDRAM 109 * http://en.wikipedia.org/wiki/DDR_SDRAM 110 * @MEM_RDDR: Registered Double data rate SDRAM 111 * This is a variant of the DDR memories. 112 * A registered memory has a buffer inside it, hiding 113 * part of the memory details to the memory controller. 114 * @MEM_RMBS: Rambus DRAM, used on a few Pentium III/IV controllers. 115 * @MEM_DDR2: DDR2 RAM, as described at JEDEC JESD79-2F. 116 * Those memories are labed as "PC2-" instead of "PC" to 117 * differenciate from DDR. 118 * @MEM_FB_DDR2: Fully-Buffered DDR2, as described at JEDEC Std No. 205 119 * and JESD206. 120 * Those memories are accessed per DIMM slot, and not by 121 * a chip select signal. 122 * @MEM_RDDR2: Registered DDR2 RAM 123 * This is a variant of the DDR2 memories. 124 * @MEM_XDR: Rambus XDR 125 * It is an evolution of the original RAMBUS memories, 126 * created to compete with DDR2. Weren't used on any 127 * x86 arch, but cell_edac PPC memory controller uses it. 128 * @MEM_DDR3: DDR3 RAM 129 * @MEM_RDDR3: Registered DDR3 RAM 130 * This is a variant of the DDR3 memories. 131 */ 132enum mem_type { 133 MEM_EMPTY = 0, 134 MEM_RESERVED, 135 MEM_UNKNOWN, 136 MEM_FPM, 137 MEM_EDO, 138 MEM_BEDO, 139 MEM_SDR, 140 MEM_RDR, 141 MEM_DDR, 142 MEM_RDDR, 143 MEM_RMBS, 144 MEM_DDR2, 145 MEM_FB_DDR2, 146 MEM_RDDR2, 147 MEM_XDR, 148 MEM_DDR3, 149 MEM_RDDR3, 150}; 151 152#define MEM_FLAG_EMPTY BIT(MEM_EMPTY) 153#define MEM_FLAG_RESERVED BIT(MEM_RESERVED) 154#define MEM_FLAG_UNKNOWN BIT(MEM_UNKNOWN) 155#define MEM_FLAG_FPM BIT(MEM_FPM) 156#define MEM_FLAG_EDO BIT(MEM_EDO) 157#define MEM_FLAG_BEDO BIT(MEM_BEDO) 158#define MEM_FLAG_SDR BIT(MEM_SDR) 159#define MEM_FLAG_RDR BIT(MEM_RDR) 160#define MEM_FLAG_DDR BIT(MEM_DDR) 161#define MEM_FLAG_RDDR BIT(MEM_RDDR) 162#define MEM_FLAG_RMBS BIT(MEM_RMBS) 163#define MEM_FLAG_DDR2 BIT(MEM_DDR2) 164#define MEM_FLAG_FB_DDR2 BIT(MEM_FB_DDR2) 165#define MEM_FLAG_RDDR2 BIT(MEM_RDDR2) 166#define MEM_FLAG_XDR BIT(MEM_XDR) 167#define MEM_FLAG_DDR3 BIT(MEM_DDR3) 168#define MEM_FLAG_RDDR3 BIT(MEM_RDDR3) 169 170/* chipset Error Detection and Correction capabilities and mode */ 171enum edac_type { 172 EDAC_UNKNOWN = 0, /* Unknown if ECC is available */ 173 EDAC_NONE, /* Doesn't support ECC */ 174 EDAC_RESERVED, /* Reserved ECC type */ 175 EDAC_PARITY, /* Detects parity errors */ 176 EDAC_EC, /* Error Checking - no correction */ 177 EDAC_SECDED, /* Single bit error correction, Double detection */ 178 EDAC_S2ECD2ED, /* Chipkill x2 devices - do these exist? */ 179 EDAC_S4ECD4ED, /* Chipkill x4 devices */ 180 EDAC_S8ECD8ED, /* Chipkill x8 devices */ 181 EDAC_S16ECD16ED, /* Chipkill x16 devices */ 182}; 183 184#define EDAC_FLAG_UNKNOWN BIT(EDAC_UNKNOWN) 185#define EDAC_FLAG_NONE BIT(EDAC_NONE) 186#define EDAC_FLAG_PARITY BIT(EDAC_PARITY) 187#define EDAC_FLAG_EC BIT(EDAC_EC) 188#define EDAC_FLAG_SECDED BIT(EDAC_SECDED) 189#define EDAC_FLAG_S2ECD2ED BIT(EDAC_S2ECD2ED) 190#define EDAC_FLAG_S4ECD4ED BIT(EDAC_S4ECD4ED) 191#define EDAC_FLAG_S8ECD8ED BIT(EDAC_S8ECD8ED) 192#define EDAC_FLAG_S16ECD16ED BIT(EDAC_S16ECD16ED) 193 194/* scrubbing capabilities */ 195enum scrub_type { 196 SCRUB_UNKNOWN = 0, /* Unknown if scrubber is available */ 197 SCRUB_NONE, /* No scrubber */ 198 SCRUB_SW_PROG, /* SW progressive (sequential) scrubbing */ 199 SCRUB_SW_SRC, /* Software scrub only errors */ 200 SCRUB_SW_PROG_SRC, /* Progressive software scrub from an error */ 201 SCRUB_SW_TUNABLE, /* Software scrub frequency is tunable */ 202 SCRUB_HW_PROG, /* HW progressive (sequential) scrubbing */ 203 SCRUB_HW_SRC, /* Hardware scrub only errors */ 204 SCRUB_HW_PROG_SRC, /* Progressive hardware scrub from an error */ 205 SCRUB_HW_TUNABLE /* Hardware scrub frequency is tunable */ 206}; 207 208#define SCRUB_FLAG_SW_PROG BIT(SCRUB_SW_PROG) 209#define SCRUB_FLAG_SW_SRC BIT(SCRUB_SW_SRC) 210#define SCRUB_FLAG_SW_PROG_SRC BIT(SCRUB_SW_PROG_SRC) 211#define SCRUB_FLAG_SW_TUN BIT(SCRUB_SW_SCRUB_TUNABLE) 212#define SCRUB_FLAG_HW_PROG BIT(SCRUB_HW_PROG) 213#define SCRUB_FLAG_HW_SRC BIT(SCRUB_HW_SRC) 214#define SCRUB_FLAG_HW_PROG_SRC BIT(SCRUB_HW_PROG_SRC) 215#define SCRUB_FLAG_HW_TUN BIT(SCRUB_HW_TUNABLE) 216 217/* FIXME - should have notify capabilities: NMI, LOG, PROC, etc */ 218 219/* EDAC internal operation states */ 220#define OP_ALLOC 0x100 221#define OP_RUNNING_POLL 0x201 222#define OP_RUNNING_INTERRUPT 0x202 223#define OP_RUNNING_POLL_INTR 0x203 224#define OP_OFFLINE 0x300 225 226/* 227 * Concepts used at the EDAC subsystem 228 * 229 * There are several things to be aware of that aren't at all obvious: 230 * 231 * SOCKETS, SOCKET SETS, BANKS, ROWS, CHIP-SELECT ROWS, CHANNELS, etc.. 232 * 233 * These are some of the many terms that are thrown about that don't always 234 * mean what people think they mean (Inconceivable!). In the interest of 235 * creating a common ground for discussion, terms and their definitions 236 * will be established. 237 * 238 * Memory devices: The individual DRAM chips on a memory stick. These 239 * devices commonly output 4 and 8 bits each (x4, x8). 240 * Grouping several of these in parallel provides the 241 * number of bits that the memory controller expects: 242 * typically 72 bits, in order to provide 64 bits + 243 * 8 bits of ECC data. 244 * 245 * Memory Stick: A printed circuit board that aggregates multiple 246 * memory devices in parallel. In general, this is the 247 * Field Replaceable Unit (FRU) which gets replaced, in 248 * the case of excessive errors. Most often it is also 249 * called DIMM (Dual Inline Memory Module). 250 * 251 * Memory Socket: A physical connector on the motherboard that accepts 252 * a single memory stick. Also called as "slot" on several 253 * datasheets. 254 * 255 * Channel: A memory controller channel, responsible to communicate 256 * with a group of DIMMs. Each channel has its own 257 * independent control (command) and data bus, and can 258 * be used independently or grouped with other channels. 259 * 260 * Branch: It is typically the highest hierarchy on a 261 * Fully-Buffered DIMM memory controller. 262 * Typically, it contains two channels. 263 * Two channels at the same branch can be used in single 264 * mode or in lockstep mode. 265 * When lockstep is enabled, the cacheline is doubled, 266 * but it generally brings some performance penalty. 267 * Also, it is generally not possible to point to just one 268 * memory stick when an error occurs, as the error 269 * correction code is calculated using two DIMMs instead 270 * of one. Due to that, it is capable of correcting more 271 * errors than on single mode. 272 * 273 * Single-channel: The data accessed by the memory controller is contained 274 * into one dimm only. E. g. if the data is 64 bits-wide, 275 * the data flows to the CPU using one 64 bits parallel 276 * access. 277 * Typically used with SDR, DDR, DDR2 and DDR3 memories. 278 * FB-DIMM and RAMBUS use a different concept for channel, 279 * so this concept doesn't apply there. 280 * 281 * Double-channel: The data size accessed by the memory controller is 282 * interlaced into two dimms, accessed at the same time. 283 * E. g. if the DIMM is 64 bits-wide (72 bits with ECC), 284 * the data flows to the CPU using a 128 bits parallel 285 * access. 286 * 287 * Chip-select row: This is the name of the DRAM signal used to select the 288 * DRAM ranks to be accessed. Common chip-select rows for 289 * single channel are 64 bits, for dual channel 128 bits. 290 * It may not be visible by the memory controller, as some 291 * DIMM types have a memory buffer that can hide direct 292 * access to it from the Memory Controller. 293 * 294 * Single-Ranked stick: A Single-ranked stick has 1 chip-select row of memory. 295 * Motherboards commonly drive two chip-select pins to 296 * a memory stick. A single-ranked stick, will occupy 297 * only one of those rows. The other will be unused. 298 * 299 * Double-Ranked stick: A double-ranked stick has two chip-select rows which 300 * access different sets of memory devices. The two 301 * rows cannot be accessed concurrently. 302 * 303 * Double-sided stick: DEPRECATED TERM, see Double-Ranked stick. 304 * A double-sided stick has two chip-select rows which 305 * access different sets of memory devices. The two 306 * rows cannot be accessed concurrently. "Double-sided" 307 * is irrespective of the memory devices being mounted 308 * on both sides of the memory stick. 309 * 310 * Socket set: All of the memory sticks that are required for 311 * a single memory access or all of the memory sticks 312 * spanned by a chip-select row. A single socket set 313 * has two chip-select rows and if double-sided sticks 314 * are used these will occupy those chip-select rows. 315 * 316 * Bank: This term is avoided because it is unclear when 317 * needing to distinguish between chip-select rows and 318 * socket sets. 319 * 320 * Controller pages: 321 * 322 * Physical pages: 323 * 324 * Virtual pages: 325 * 326 * 327 * STRUCTURE ORGANIZATION AND CHOICES 328 * 329 * 330 * 331 * PS - I enjoyed writing all that about as much as you enjoyed reading it. 332 */ 333 334/** 335 * enum edac_mc_layer - memory controller hierarchy layer 336 * 337 * @EDAC_MC_LAYER_BRANCH: memory layer is named "branch" 338 * @EDAC_MC_LAYER_CHANNEL: memory layer is named "channel" 339 * @EDAC_MC_LAYER_SLOT: memory layer is named "slot" 340 * @EDAC_MC_LAYER_CHIP_SELECT: memory layer is named "chip select" 341 * 342 * This enum is used by the drivers to tell edac_mc_sysfs what name should 343 * be used when describing a memory stick location. 344 */ 345enum edac_mc_layer_type { 346 EDAC_MC_LAYER_BRANCH, 347 EDAC_MC_LAYER_CHANNEL, 348 EDAC_MC_LAYER_SLOT, 349 EDAC_MC_LAYER_CHIP_SELECT, 350}; 351 352/** 353 * struct edac_mc_layer - describes the memory controller hierarchy 354 * @layer: layer type 355 * @size: number of components per layer. For example, 356 * if the channel layer has two channels, size = 2 357 * @is_virt_csrow: This layer is part of the "csrow" when old API 358 * compatibility mode is enabled. Otherwise, it is 359 * a channel 360 */ 361struct edac_mc_layer { 362 enum edac_mc_layer_type type; 363 unsigned size; 364 bool is_virt_csrow; 365}; 366 367/* 368 * Maximum number of layers used by the memory controller to uniquely 369 * identify a single memory stick. 370 * NOTE: Changing this constant requires not only to change the constant 371 * below, but also to change the existing code at the core, as there are 372 * some code there that are optimized for 3 layers. 373 */ 374#define EDAC_MAX_LAYERS 3 375 376/** 377 * EDAC_DIMM_PTR - Macro responsible to find a pointer inside a pointer array 378 * for the element given by [layer0,layer1,layer2] position 379 * 380 * @layers: a struct edac_mc_layer array, describing how many elements 381 * were allocated for each layer 382 * @var: name of the var where we want to get the pointer 383 * (like mci->dimms) 384 * @n_layers: Number of layers at the @layers array 385 * @layer0: layer0 position 386 * @layer1: layer1 position. Unused if n_layers < 2 387 * @layer2: layer2 position. Unused if n_layers < 3 388 * 389 * For 1 layer, this macro returns &var[layer0] 390 * For 2 layers, this macro is similar to allocate a bi-dimensional array 391 * and to return "&var[layer0][layer1]" 392 * For 3 layers, this macro is similar to allocate a tri-dimensional array 393 * and to return "&var[layer0][layer1][layer2]" 394 * 395 * A loop could be used here to make it more generic, but, as we only have 396 * 3 layers, this is a little faster. 397 * By design, layers can never be 0 or more than 3. If that ever happens, 398 * a NULL is returned, causing an OOPS during the memory allocation routine, 399 * with would point to the developer that he's doing something wrong. 400 */ 401#define EDAC_DIMM_PTR(layers, var, nlayers, layer0, layer1, layer2) ({ \ 402 typeof(var) __p; \ 403 if ((nlayers) == 1) \ 404 __p = &var[layer0]; \ 405 else if ((nlayers) == 2) \ 406 __p = &var[(layer1) + ((layers[1]).size * (layer0))]; \ 407 else if ((nlayers) == 3) \ 408 __p = &var[(layer2) + ((layers[2]).size * ((layer1) + \ 409 ((layers[1]).size * (layer0))))]; \ 410 else \ 411 __p = NULL; \ 412 __p; \ 413}) 414 415 416/* FIXME: add the proper per-location error counts */ 417struct dimm_info { 418 char label[EDAC_MC_LABEL_LEN + 1]; /* DIMM label on motherboard */ 419 420 /* Memory location data */ 421 unsigned location[EDAC_MAX_LAYERS]; 422 423 struct mem_ctl_info *mci; /* the parent */ 424 425 u32 grain; /* granularity of reported error in bytes */ 426 enum dev_type dtype; /* memory device type */ 427 enum mem_type mtype; /* memory dimm type */ 428 enum edac_type edac_mode; /* EDAC mode for this dimm */ 429 430 u32 nr_pages; /* number of pages on this dimm */ 431 432 unsigned csrow, cschannel; /* Points to the old API data */ 433}; 434 435/** 436 * struct rank_info - contains the information for one DIMM rank 437 * 438 * @chan_idx: channel number where the rank is (typically, 0 or 1) 439 * @ce_count: number of correctable errors for this rank 440 * @csrow: A pointer to the chip select row structure (the parent 441 * structure). The location of the rank is given by 442 * the (csrow->csrow_idx, chan_idx) vector. 443 * @dimm: A pointer to the DIMM structure, where the DIMM label 444 * information is stored. 445 * 446 * FIXME: Currently, the EDAC core model will assume one DIMM per rank. 447 * This is a bad assumption, but it makes this patch easier. Later 448 * patches in this series will fix this issue. 449 */ 450struct rank_info { 451 int chan_idx; 452 struct csrow_info *csrow; 453 struct dimm_info *dimm; 454 455 u32 ce_count; /* Correctable Errors for this csrow */ 456}; 457 458struct csrow_info { 459 /* Used only by edac_mc_find_csrow_by_page() */ 460 unsigned long first_page; /* first page number in csrow */ 461 unsigned long last_page; /* last page number in csrow */ 462 unsigned long page_mask; /* used for interleaving - 463 * 0UL for non intlv */ 464 465 int csrow_idx; /* the chip-select row */ 466 467 u32 ue_count; /* Uncorrectable Errors for this csrow */ 468 u32 ce_count; /* Correctable Errors for this csrow */ 469 470 struct mem_ctl_info *mci; /* the parent */ 471 472 struct kobject kobj; /* sysfs kobject for this csrow */ 473 474 /* channel information for this csrow */ 475 u32 nr_channels; 476 struct rank_info *channels; 477}; 478 479struct mcidev_sysfs_group { 480 const char *name; /* group name */ 481 const struct mcidev_sysfs_attribute *mcidev_attr; /* group attributes */ 482}; 483 484struct mcidev_sysfs_group_kobj { 485 struct list_head list; /* list for all instances within a mc */ 486 487 struct kobject kobj; /* kobj for the group */ 488 489 const struct mcidev_sysfs_group *grp; /* group description table */ 490 struct mem_ctl_info *mci; /* the parent */ 491}; 492 493/* mcidev_sysfs_attribute structure 494 * used for driver sysfs attributes and in mem_ctl_info 495 * sysfs top level entries 496 */ 497struct mcidev_sysfs_attribute { 498 /* It should use either attr or grp */ 499 struct attribute attr; 500 const struct mcidev_sysfs_group *grp; /* Points to a group of attributes */ 501 502 /* Ops for show/store values at the attribute - not used on group */ 503 ssize_t (*show)(struct mem_ctl_info *,char *); 504 ssize_t (*store)(struct mem_ctl_info *, const char *,size_t); 505}; 506 507/* MEMORY controller information structure 508 */ 509struct mem_ctl_info { 510 struct list_head link; /* for global list of mem_ctl_info structs */ 511 512 struct module *owner; /* Module owner of this control struct */ 513 514 unsigned long mtype_cap; /* memory types supported by mc */ 515 unsigned long edac_ctl_cap; /* Mem controller EDAC capabilities */ 516 unsigned long edac_cap; /* configuration capabilities - this is 517 * closely related to edac_ctl_cap. The 518 * difference is that the controller may be 519 * capable of s4ecd4ed which would be listed 520 * in edac_ctl_cap, but if channels aren't 521 * capable of s4ecd4ed then the edac_cap would 522 * not have that capability. 523 */ 524 unsigned long scrub_cap; /* chipset scrub capabilities */ 525 enum scrub_type scrub_mode; /* current scrub mode */ 526 527 /* Translates sdram memory scrub rate given in bytes/sec to the 528 internal representation and configures whatever else needs 529 to be configured. 530 */ 531 int (*set_sdram_scrub_rate) (struct mem_ctl_info * mci, u32 bw); 532 533 /* Get the current sdram memory scrub rate from the internal 534 representation and converts it to the closest matching 535 bandwidth in bytes/sec. 536 */ 537 int (*get_sdram_scrub_rate) (struct mem_ctl_info * mci); 538 539 540 /* pointer to edac checking routine */ 541 void (*edac_check) (struct mem_ctl_info * mci); 542 543 /* 544 * Remaps memory pages: controller pages to physical pages. 545 * For most MC's, this will be NULL. 546 */ 547 /* FIXME - why not send the phys page to begin with? */ 548 unsigned long (*ctl_page_to_phys) (struct mem_ctl_info * mci, 549 unsigned long page); 550 int mc_idx; 551 struct csrow_info *csrows; 552 unsigned nr_csrows, num_cschannel; 553 554 /* Memory Controller hierarchy */ 555 unsigned n_layers; 556 struct edac_mc_layer *layers; 557 bool mem_is_per_rank; 558 559 /* 560 * DIMM info. Will eventually remove the entire csrows_info some day 561 */ 562 unsigned tot_dimms; 563 struct dimm_info *dimms; 564 565 /* 566 * FIXME - what about controllers on other busses? - IDs must be 567 * unique. dev pointer should be sufficiently unique, but 568 * BUS:SLOT.FUNC numbers may not be unique. 569 */ 570 struct device *dev; 571 const char *mod_name; 572 const char *mod_ver; 573 const char *ctl_name; 574 const char *dev_name; 575 char proc_name[MC_PROC_NAME_MAX_LEN + 1]; 576 void *pvt_info; 577 unsigned long start_time; /* mci load start time (in jiffies) */ 578 579 /* 580 * drivers shouldn't access those fields directly, as the core 581 * already handles that. 582 */ 583 u32 ce_noinfo_count, ue_noinfo_count; 584 u32 ue_mc, ce_mc; 585 u32 *ce_per_layer[EDAC_MAX_LAYERS], *ue_per_layer[EDAC_MAX_LAYERS]; 586 587 struct completion complete; 588 589 /* edac sysfs device control */ 590 struct kobject edac_mci_kobj; 591 592 /* list for all grp instances within a mc */ 593 struct list_head grp_kobj_list; 594 595 /* Additional top controller level attributes, but specified 596 * by the low level driver. 597 * 598 * Set by the low level driver to provide attributes at the 599 * controller level. 600 * An array of structures, NULL terminated 601 * 602 * If attributes are desired, then set to array of attributes 603 * If no attributes are desired, leave NULL 604 */ 605 const struct mcidev_sysfs_attribute *mc_driver_sysfs_attributes; 606 607 /* work struct for this MC */ 608 struct delayed_work work; 609 610 /* the internal state of this controller instance */ 611 int op_state; 612}; 613 614#endif 615