1/* 2 * Copyright 2008 Freescale Semiconductor, Inc. 3 * 4 * This program is free software; you can redistribute it and/or 5 * modify it under the terms of the GNU General Public License 6 * Version 2 as published by the Free Software Foundation. 7 */ 8 9#ifndef _DDR_SPD_H_ 10#define _DDR_SPD_H_ 11 12/* 13 * Format from "JEDEC Standard No. 21-C, 14 * Appendix D: Rev 1.0: SPD's for DDR SDRAM 15 */ 16typedef struct ddr1_spd_eeprom_s { 17 unsigned char info_size; /* 0 # bytes written into serial memory */ 18 unsigned char chip_size; /* 1 Total # bytes of SPD memory device */ 19 unsigned char mem_type; /* 2 Fundamental memory type */ 20 unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */ 21 unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */ 22 unsigned char nrows; /* 5 Number of DIMM Banks */ 23 unsigned char dataw_lsb; /* 6 Data Width of this assembly */ 24 unsigned char dataw_msb; /* 7 ... Data Width continuation */ 25 unsigned char voltage; /* 8 Voltage intf std of this assembly */ 26 unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */ 27 unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */ 28 unsigned char config; /* 11 DIMM Configuration type */ 29 unsigned char refresh; /* 12 Refresh Rate/Type */ 30 unsigned char primw; /* 13 Primary SDRAM Width */ 31 unsigned char ecw; /* 14 Error Checking SDRAM width */ 32 unsigned char min_delay; /* 15 for Back to Back Random Address */ 33 unsigned char burstl; /* 16 Burst Lengths Supported */ 34 unsigned char nbanks; /* 17 # of Banks on SDRAM Device */ 35 unsigned char cas_lat; /* 18 CAS# Latencies Supported */ 36 unsigned char cs_lat; /* 19 CS# Latency */ 37 unsigned char write_lat; /* 20 Write Latency (aka Write Recovery) */ 38 unsigned char mod_attr; /* 21 SDRAM Module Attributes */ 39 unsigned char dev_attr; /* 22 SDRAM Device Attributes */ 40 unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-0.5 */ 41 unsigned char clk_access2; /* 24 SDRAM Access from 42 Clk @ CL=X-0.5 (tAC) */ 43 unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-1 */ 44 unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-1 (tAC) */ 45 unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/ 46 unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */ 47 unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */ 48 unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */ 49 unsigned char bank_dens; /* 31 Density of each bank on module */ 50 unsigned char ca_setup; /* 32 Addr + Cmd Setup Time Before Clk */ 51 unsigned char ca_hold; /* 33 Addr + Cmd Hold Time After Clk */ 52 unsigned char data_setup; /* 34 Data Input Setup Time Before Strobe */ 53 unsigned char data_hold; /* 35 Data Input Hold Time After Strobe */ 54 unsigned char res_36_40[5];/* 36-40 reserved for VCSDRAM */ 55 unsigned char trc; /* 41 Min Active to Auto refresh time tRC */ 56 unsigned char trfc; /* 42 Min Auto to Active period tRFC */ 57 unsigned char tckmax; /* 43 Max device cycle time tCKmax */ 58 unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */ 59 unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */ 60 unsigned char res_46; /* 46 Reserved */ 61 unsigned char dimm_height; /* 47 DDR SDRAM DIMM Height */ 62 unsigned char res_48_61[14]; /* 48-61 Reserved */ 63 unsigned char spd_rev; /* 62 SPD Data Revision Code */ 64 unsigned char cksum; /* 63 Checksum for bytes 0-62 */ 65 unsigned char mid[8]; /* 64-71 Mfr's JEDEC ID code per JEP-106 */ 66 unsigned char mloc; /* 72 Manufacturing Location */ 67 unsigned char mpart[18]; /* 73 Manufacturer's Part Number */ 68 unsigned char rev[2]; /* 91 Revision Code */ 69 unsigned char mdate[2]; /* 93 Manufacturing Date */ 70 unsigned char sernum[4]; /* 95 Assembly Serial Number */ 71 unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */ 72 73} ddr1_spd_eeprom_t; 74 75/* 76 * Format from "JEDEC Appendix X: Serial Presence Detects for DDR2 SDRAM", 77 * SPD Revision 1.2 78 */ 79typedef struct ddr2_spd_eeprom_s { 80 unsigned char info_size; /* 0 # bytes written into serial memory */ 81 unsigned char chip_size; /* 1 Total # bytes of SPD memory device */ 82 unsigned char mem_type; /* 2 Fundamental memory type */ 83 unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */ 84 unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */ 85 unsigned char mod_ranks; /* 5 Number of DIMM Ranks */ 86 unsigned char dataw; /* 6 Module Data Width */ 87 unsigned char res_7; /* 7 Reserved */ 88 unsigned char voltage; /* 8 Voltage intf std of this assembly */ 89 unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */ 90 unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */ 91 unsigned char config; /* 11 DIMM Configuration type */ 92 unsigned char refresh; /* 12 Refresh Rate/Type */ 93 unsigned char primw; /* 13 Primary SDRAM Width */ 94 unsigned char ecw; /* 14 Error Checking SDRAM width */ 95 unsigned char res_15; /* 15 Reserved */ 96 unsigned char burstl; /* 16 Burst Lengths Supported */ 97 unsigned char nbanks; /* 17 # of Banks on Each SDRAM Device */ 98 unsigned char cas_lat; /* 18 CAS# Latencies Supported */ 99 unsigned char mech_char; /* 19 DIMM Mechanical Characteristics */ 100 unsigned char dimm_type; /* 20 DIMM type information */ 101 unsigned char mod_attr; /* 21 SDRAM Module Attributes */ 102 unsigned char dev_attr; /* 22 SDRAM Device Attributes */ 103 unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-1 */ 104 unsigned char clk_access2; /* 24 SDRAM Access from Clk @ CL=X-1 (tAC) */ 105 unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-2 */ 106 unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-2 (tAC) */ 107 unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/ 108 unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */ 109 unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */ 110 unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */ 111 unsigned char rank_dens; /* 31 Density of each rank on module */ 112 unsigned char ca_setup; /* 32 Addr+Cmd Setup Time Before Clk (tIS) */ 113 unsigned char ca_hold; /* 33 Addr+Cmd Hold Time After Clk (tIH) */ 114 unsigned char data_setup; /* 34 Data Input Setup Time 115 Before Strobe (tDS) */ 116 unsigned char data_hold; /* 35 Data Input Hold Time 117 After Strobe (tDH) */ 118 unsigned char twr; /* 36 Write Recovery time tWR */ 119 unsigned char twtr; /* 37 Int write to read delay tWTR */ 120 unsigned char trtp; /* 38 Int read to precharge delay tRTP */ 121 unsigned char mem_probe; /* 39 Mem analysis probe characteristics */ 122 unsigned char trctrfc_ext; /* 40 Extensions to trc and trfc */ 123 unsigned char trc; /* 41 Min Active to Auto refresh time tRC */ 124 unsigned char trfc; /* 42 Min Auto to Active period tRFC */ 125 unsigned char tckmax; /* 43 Max device cycle time tCKmax */ 126 unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */ 127 unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */ 128 unsigned char pll_relock; /* 46 PLL Relock time */ 129 unsigned char Tcasemax; /* 47 Tcasemax */ 130 unsigned char psiTAdram; /* 48 Thermal Resistance of DRAM Package from 131 Top (Case) to Ambient (Psi T-A DRAM) */ 132 unsigned char dt0_mode; /* 49 DRAM Case Temperature Rise from Ambient 133 due to Activate-Precharge/Mode Bits 134 (DT0/Mode Bits) */ 135 unsigned char dt2n_dt2q; /* 50 DRAM Case Temperature Rise from Ambient 136 due to Precharge/Quiet Standby 137 (DT2N/DT2Q) */ 138 unsigned char dt2p; /* 51 DRAM Case Temperature Rise from Ambient 139 due to Precharge Power-Down (DT2P) */ 140 unsigned char dt3n; /* 52 DRAM Case Temperature Rise from Ambient 141 due to Active Standby (DT3N) */ 142 unsigned char dt3pfast; /* 53 DRAM Case Temperature Rise from Ambient 143 due to Active Power-Down with 144 Fast PDN Exit (DT3Pfast) */ 145 unsigned char dt3pslow; /* 54 DRAM Case Temperature Rise from Ambient 146 due to Active Power-Down with Slow 147 PDN Exit (DT3Pslow) */ 148 unsigned char dt4r_dt4r4w; /* 55 DRAM Case Temperature Rise from Ambient 149 due to Page Open Burst Read/DT4R4W 150 Mode Bit (DT4R/DT4R4W Mode Bit) */ 151 unsigned char dt5b; /* 56 DRAM Case Temperature Rise from Ambient 152 due to Burst Refresh (DT5B) */ 153 unsigned char dt7; /* 57 DRAM Case Temperature Rise from Ambient 154 due to Bank Interleave Reads with 155 Auto-Precharge (DT7) */ 156 unsigned char psiTApll; /* 58 Thermal Resistance of PLL Package form 157 Top (Case) to Ambient (Psi T-A PLL) */ 158 unsigned char psiTAreg; /* 59 Thermal Reisitance of Register Package 159 from Top (Case) to Ambient 160 (Psi T-A Register) */ 161 unsigned char dtpllactive; /* 60 PLL Case Temperature Rise from Ambient 162 due to PLL Active (DT PLL Active) */ 163 unsigned char dtregact; /* 61 Register Case Temperature Rise from 164 Ambient due to Register Active/Mode Bit 165 (DT Register Active/Mode Bit) */ 166 unsigned char spd_rev; /* 62 SPD Data Revision Code */ 167 unsigned char cksum; /* 63 Checksum for bytes 0-62 */ 168 unsigned char mid[8]; /* 64 Mfr's JEDEC ID code per JEP-106 */ 169 unsigned char mloc; /* 72 Manufacturing Location */ 170 unsigned char mpart[18]; /* 73 Manufacturer's Part Number */ 171 unsigned char rev[2]; /* 91 Revision Code */ 172 unsigned char mdate[2]; /* 93 Manufacturing Date */ 173 unsigned char sernum[4]; /* 95 Assembly Serial Number */ 174 unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */ 175 176} ddr2_spd_eeprom_t; 177 178typedef struct ddr3_spd_eeprom_s { 179 /* General Section: Bytes 0-59 */ 180 unsigned char info_size_crc; /* 0 # bytes written into serial memory, 181 CRC coverage */ 182 unsigned char spd_rev; /* 1 Total # bytes of SPD mem device */ 183 unsigned char mem_type; /* 2 Key Byte / Fundamental mem type */ 184 unsigned char module_type; /* 3 Key Byte / Module Type */ 185 unsigned char density_banks; /* 4 SDRAM Density and Banks */ 186 unsigned char addressing; /* 5 SDRAM Addressing */ 187 unsigned char module_vdd; /* 6 Module nominal voltage, VDD */ 188 unsigned char organization; /* 7 Module Organization */ 189 unsigned char bus_width; /* 8 Module Memory Bus Width */ 190 unsigned char ftb_div; /* 9 Fine Timebase (FTB) 191 Dividend / Divisor */ 192 unsigned char mtb_dividend; /* 10 Medium Timebase (MTB) Dividend */ 193 unsigned char mtb_divisor; /* 11 Medium Timebase (MTB) Divisor */ 194 unsigned char tCK_min; /* 12 SDRAM Minimum Cycle Time */ 195 unsigned char res_13; /* 13 Reserved */ 196 unsigned char caslat_lsb; /* 14 CAS Latencies Supported, 197 Least Significant Byte */ 198 unsigned char caslat_msb; /* 15 CAS Latencies Supported, 199 Most Significant Byte */ 200 unsigned char tAA_min; /* 16 Min CAS Latency Time */ 201 unsigned char tWR_min; /* 17 Min Write REcovery Time */ 202 unsigned char tRCD_min; /* 18 Min RAS# to CAS# Delay Time */ 203 unsigned char tRRD_min; /* 19 Min Row Active to 204 Row Active Delay Time */ 205 unsigned char tRP_min; /* 20 Min Row Precharge Delay Time */ 206 unsigned char tRAS_tRC_ext; /* 21 Upper Nibbles for tRAS and tRC */ 207 unsigned char tRAS_min_lsb; /* 22 Min Active to Precharge 208 Delay Time */ 209 unsigned char tRC_min_lsb; /* 23 Min Active to Active/Refresh 210 Delay Time, LSB */ 211 unsigned char tRFC_min_lsb; /* 24 Min Refresh Recovery Delay Time */ 212 unsigned char tRFC_min_msb; /* 25 Min Refresh Recovery Delay Time */ 213 unsigned char tWTR_min; /* 26 Min Internal Write to 214 Read Command Delay Time */ 215 unsigned char tRTP_min; /* 27 Min Internal Read to Precharge 216 Command Delay Time */ 217 unsigned char tFAW_msb; /* 28 Upper Nibble for tFAW */ 218 unsigned char tFAW_min; /* 29 Min Four Activate Window 219 Delay Time*/ 220 unsigned char opt_features; /* 30 SDRAM Optional Features */ 221 unsigned char therm_ref_opt; /* 31 SDRAM Thermal and Refresh Opts */ 222 unsigned char therm_sensor; /* 32 Module Thermal Sensor */ 223 unsigned char device_type; /* 33 SDRAM device type */ 224 unsigned char res_34_59[26]; /* 34-59 Reserved, General Section */ 225 226 /* Module-Specific Section: Bytes 60-116 */ 227 union { 228 struct { 229 /* 60 (Unbuffered) Module Nominal Height */ 230 unsigned char mod_height; 231 /* 61 (Unbuffered) Module Maximum Thickness */ 232 unsigned char mod_thickness; 233 /* 62 (Unbuffered) Reference Raw Card Used */ 234 unsigned char ref_raw_card; 235 /* 63 (Unbuffered) Address Mapping from 236 Edge Connector to DRAM */ 237 unsigned char addr_mapping; 238 /* 64-116 (Unbuffered) Reserved */ 239 unsigned char res_64_116[53]; 240 } unbuffered; 241 struct { 242 /* 60 (Registered) Module Nominal Height */ 243 unsigned char mod_height; 244 /* 61 (Registered) Module Maximum Thickness */ 245 unsigned char mod_thickness; 246 /* 62 (Registered) Reference Raw Card Used */ 247 unsigned char ref_raw_card; 248 /* 63 DIMM Module Attributes */ 249 unsigned char modu_attr; 250 /* 64 RDIMM Thermal Heat Spreader Solution */ 251 unsigned char thermal; 252 /* 65 Register Manufacturer ID Code, Least Significant Byte */ 253 unsigned char reg_id_lo; 254 /* 66 Register Manufacturer ID Code, Most Significant Byte */ 255 unsigned char reg_id_hi; 256 /* 67 Register Revision Number */ 257 unsigned char reg_rev; 258 /* 68 Register Type */ 259 unsigned char reg_type; 260 /* 69-76 RC1,3,5...15 (MS Nibble) / RC0,2,4...14 (LS Nibble) */ 261 unsigned char rcw[8]; 262 } registered; 263 unsigned char uc[57]; /* 60-116 Module-Specific Section */ 264 } mod_section; 265 266 /* Unique Module ID: Bytes 117-125 */ 267 unsigned char mmid_lsb; /* 117 Module MfgID Code LSB - JEP-106 */ 268 unsigned char mmid_msb; /* 118 Module MfgID Code MSB - JEP-106 */ 269 unsigned char mloc; /* 119 Mfg Location */ 270 unsigned char mdate[2]; /* 120-121 Mfg Date */ 271 unsigned char sernum[4]; /* 122-125 Module Serial Number */ 272 273 /* CRC: Bytes 126-127 */ 274 unsigned char crc[2]; /* 126-127 SPD CRC */ 275 276 /* Other Manufacturer Fields and User Space: Bytes 128-255 */ 277 unsigned char mpart[18]; /* 128-145 Mfg's Module Part Number */ 278 unsigned char mrev[2]; /* 146-147 Module Revision Code */ 279 280 unsigned char dmid_lsb; /* 148 DRAM MfgID Code LSB - JEP-106 */ 281 unsigned char dmid_msb; /* 149 DRAM MfgID Code MSB - JEP-106 */ 282 283 unsigned char msd[26]; /* 150-175 Mfg's Specific Data */ 284 unsigned char cust[80]; /* 176-255 Open for Customer Use */ 285 286} ddr3_spd_eeprom_t; 287 288extern unsigned int ddr1_spd_check(const ddr1_spd_eeprom_t *spd); 289extern void ddr1_spd_dump(const ddr1_spd_eeprom_t *spd); 290extern unsigned int ddr2_spd_check(const ddr2_spd_eeprom_t *spd); 291extern void ddr2_spd_dump(const ddr2_spd_eeprom_t *spd); 292extern unsigned int ddr3_spd_check(const ddr3_spd_eeprom_t *spd); 293 294/* 295 * Byte 2 Fundamental Memory Types. 296 */ 297#define SPD_MEMTYPE_FPM (0x01) 298#define SPD_MEMTYPE_EDO (0x02) 299#define SPD_MEMTYPE_PIPE_NIBBLE (0x03) 300#define SPD_MEMTYPE_SDRAM (0x04) 301#define SPD_MEMTYPE_ROM (0x05) 302#define SPD_MEMTYPE_SGRAM (0x06) 303#define SPD_MEMTYPE_DDR (0x07) 304#define SPD_MEMTYPE_DDR2 (0x08) 305#define SPD_MEMTYPE_DDR2_FBDIMM (0x09) 306#define SPD_MEMTYPE_DDR2_FBDIMM_PROBE (0x0A) 307#define SPD_MEMTYPE_DDR3 (0x0B) 308 309/* DIMM Type for DDR2 SPD (according to v1.3) */ 310#define DDR2_SPD_DIMMTYPE_UNDEFINED (0x00) 311#define DDR2_SPD_DIMMTYPE_RDIMM (0x01) 312#define DDR2_SPD_DIMMTYPE_UDIMM (0x02) 313#define DDR2_SPD_DIMMTYPE_SO_DIMM (0x04) 314#define DDR2_SPD_DIMMTYPE_72B_SO_CDIMM (0x06) 315#define DDR2_SPD_DIMMTYPE_72B_SO_RDIMM (0x07) 316#define DDR2_SPD_DIMMTYPE_MICRO_DIMM (0x08) 317#define DDR2_SPD_DIMMTYPE_MINI_RDIMM (0x10) 318#define DDR2_SPD_DIMMTYPE_MINI_UDIMM (0x20) 319 320/* Byte 3 Key Byte / Module Type for DDR3 SPD */ 321#define DDR3_SPD_MODULETYPE_MASK (0x0f) 322#define DDR3_SPD_MODULETYPE_RDIMM (0x01) 323#define DDR3_SPD_MODULETYPE_UDIMM (0x02) 324#define DDR3_SPD_MODULETYPE_SO_DIMM (0x03) 325#define DDR3_SPD_MODULETYPE_MICRO_DIMM (0x04) 326#define DDR3_SPD_MODULETYPE_MINI_RDIMM (0x05) 327#define DDR3_SPD_MODULETYPE_MINI_UDIMM (0x06) 328 329#endif /* _DDR_SPD_H_ */ 330