1/* SPDX-License-Identifier: GPL-2.0 */ 2/* 3 * Copyright 2008-2014 Freescale Semiconductor, Inc. 4 */ 5 6#ifndef _DDR_SPD_H_ 7#define _DDR_SPD_H_ 8 9/* 10 * Format from "JEDEC Standard No. 21-C, 11 * Appendix D: Rev 1.0: SPD's for DDR SDRAM 12 */ 13typedef struct ddr1_spd_eeprom_s { 14 unsigned char info_size; /* 0 # bytes written into serial memory */ 15 unsigned char chip_size; /* 1 Total # bytes of SPD memory device */ 16 unsigned char mem_type; /* 2 Fundamental memory type */ 17 unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */ 18 unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */ 19 unsigned char nrows; /* 5 Number of DIMM Banks */ 20 unsigned char dataw_lsb; /* 6 Data Width of this assembly */ 21 unsigned char dataw_msb; /* 7 ... Data Width continuation */ 22 unsigned char voltage; /* 8 Voltage intf std of this assembly */ 23 unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */ 24 unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */ 25 unsigned char config; /* 11 DIMM Configuration type */ 26 unsigned char refresh; /* 12 Refresh Rate/Type */ 27 unsigned char primw; /* 13 Primary SDRAM Width */ 28 unsigned char ecw; /* 14 Error Checking SDRAM width */ 29 unsigned char min_delay; /* 15 for Back to Back Random Address */ 30 unsigned char burstl; /* 16 Burst Lengths Supported */ 31 unsigned char nbanks; /* 17 # of Banks on SDRAM Device */ 32 unsigned char cas_lat; /* 18 CAS# Latencies Supported */ 33 unsigned char cs_lat; /* 19 CS# Latency */ 34 unsigned char write_lat; /* 20 Write Latency (aka Write Recovery) */ 35 unsigned char mod_attr; /* 21 SDRAM Module Attributes */ 36 unsigned char dev_attr; /* 22 SDRAM Device Attributes */ 37 unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-0.5 */ 38 unsigned char clk_access2; /* 24 SDRAM Access from 39 Clk @ CL=X-0.5 (tAC) */ 40 unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-1 */ 41 unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-1 (tAC) */ 42 unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/ 43 unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */ 44 unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */ 45 unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */ 46 unsigned char bank_dens; /* 31 Density of each bank on module */ 47 unsigned char ca_setup; /* 32 Addr + Cmd Setup Time Before Clk */ 48 unsigned char ca_hold; /* 33 Addr + Cmd Hold Time After Clk */ 49 unsigned char data_setup; /* 34 Data Input Setup Time Before Strobe */ 50 unsigned char data_hold; /* 35 Data Input Hold Time After Strobe */ 51 unsigned char res_36_40[5];/* 36-40 reserved for VCSDRAM */ 52 unsigned char trc; /* 41 Min Active to Auto refresh time tRC */ 53 unsigned char trfc; /* 42 Min Auto to Active period tRFC */ 54 unsigned char tckmax; /* 43 Max device cycle time tCKmax */ 55 unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */ 56 unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */ 57 unsigned char res_46; /* 46 Reserved */ 58 unsigned char dimm_height; /* 47 DDR SDRAM DIMM Height */ 59 unsigned char res_48_61[14]; /* 48-61 Reserved */ 60 unsigned char spd_rev; /* 62 SPD Data Revision Code */ 61 unsigned char cksum; /* 63 Checksum for bytes 0-62 */ 62 unsigned char mid[8]; /* 64-71 Mfr's JEDEC ID code per JEP-106 */ 63 unsigned char mloc; /* 72 Manufacturing Location */ 64 unsigned char mpart[18]; /* 73 Manufacturer's Part Number */ 65 unsigned char rev[2]; /* 91 Revision Code */ 66 unsigned char mdate[2]; /* 93 Manufacturing Date */ 67 unsigned char sernum[4]; /* 95 Assembly Serial Number */ 68 unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */ 69 70} ddr1_spd_eeprom_t; 71 72/* 73 * Format from "JEDEC Appendix X: Serial Presence Detects for DDR2 SDRAM", 74 * SPD Revision 1.2 75 */ 76typedef struct ddr2_spd_eeprom_s { 77 unsigned char info_size; /* 0 # bytes written into serial memory */ 78 unsigned char chip_size; /* 1 Total # bytes of SPD memory device */ 79 unsigned char mem_type; /* 2 Fundamental memory type */ 80 unsigned char nrow_addr; /* 3 # of Row Addresses on this assembly */ 81 unsigned char ncol_addr; /* 4 # of Column Addrs on this assembly */ 82 unsigned char mod_ranks; /* 5 Number of DIMM Ranks */ 83 unsigned char dataw; /* 6 Module Data Width */ 84 unsigned char res_7; /* 7 Reserved */ 85 unsigned char voltage; /* 8 Voltage intf std of this assembly */ 86 unsigned char clk_cycle; /* 9 SDRAM Cycle time @ CL=X */ 87 unsigned char clk_access; /* 10 SDRAM Access from Clk @ CL=X (tAC) */ 88 unsigned char config; /* 11 DIMM Configuration type */ 89 unsigned char refresh; /* 12 Refresh Rate/Type */ 90 unsigned char primw; /* 13 Primary SDRAM Width */ 91 unsigned char ecw; /* 14 Error Checking SDRAM width */ 92 unsigned char res_15; /* 15 Reserved */ 93 unsigned char burstl; /* 16 Burst Lengths Supported */ 94 unsigned char nbanks; /* 17 # of Banks on Each SDRAM Device */ 95 unsigned char cas_lat; /* 18 CAS# Latencies Supported */ 96 unsigned char mech_char; /* 19 DIMM Mechanical Characteristics */ 97 unsigned char dimm_type; /* 20 DIMM type information */ 98 unsigned char mod_attr; /* 21 SDRAM Module Attributes */ 99 unsigned char dev_attr; /* 22 SDRAM Device Attributes */ 100 unsigned char clk_cycle2; /* 23 Min SDRAM Cycle time @ CL=X-1 */ 101 unsigned char clk_access2; /* 24 SDRAM Access from Clk @ CL=X-1 (tAC) */ 102 unsigned char clk_cycle3; /* 25 Min SDRAM Cycle time @ CL=X-2 */ 103 unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-2 (tAC) */ 104 unsigned char trp; /* 27 Min Row Precharge Time (tRP)*/ 105 unsigned char trrd; /* 28 Min Row Active to Row Active (tRRD) */ 106 unsigned char trcd; /* 29 Min RAS to CAS Delay (tRCD) */ 107 unsigned char tras; /* 30 Minimum RAS Pulse Width (tRAS) */ 108 unsigned char rank_dens; /* 31 Density of each rank on module */ 109 unsigned char ca_setup; /* 32 Addr+Cmd Setup Time Before Clk (tIS) */ 110 unsigned char ca_hold; /* 33 Addr+Cmd Hold Time After Clk (tIH) */ 111 unsigned char data_setup; /* 34 Data Input Setup Time 112 Before Strobe (tDS) */ 113 unsigned char data_hold; /* 35 Data Input Hold Time 114 After Strobe (tDH) */ 115 unsigned char twr; /* 36 Write Recovery time tWR */ 116 unsigned char twtr; /* 37 Int write to read delay tWTR */ 117 unsigned char trtp; /* 38 Int read to precharge delay tRTP */ 118 unsigned char mem_probe; /* 39 Mem analysis probe characteristics */ 119 unsigned char trctrfc_ext; /* 40 Extensions to trc and trfc */ 120 unsigned char trc; /* 41 Min Active to Auto refresh time tRC */ 121 unsigned char trfc; /* 42 Min Auto to Active period tRFC */ 122 unsigned char tckmax; /* 43 Max device cycle time tCKmax */ 123 unsigned char tdqsq; /* 44 Max DQS to DQ skew (tDQSQ max) */ 124 unsigned char tqhs; /* 45 Max Read DataHold skew (tQHS) */ 125 unsigned char pll_relock; /* 46 PLL Relock time */ 126 unsigned char t_casemax; /* 47 Tcasemax */ 127 unsigned char psi_ta_dram; /* 48 Thermal Resistance of DRAM Package from 128 Top (Case) to Ambient (Psi T-A DRAM) */ 129 unsigned char dt0_mode; /* 49 DRAM Case Temperature Rise from Ambient 130 due to Activate-Precharge/Mode Bits 131 (DT0/Mode Bits) */ 132 unsigned char dt2n_dt2q; /* 50 DRAM Case Temperature Rise from Ambient 133 due to Precharge/Quiet Standby 134 (DT2N/DT2Q) */ 135 unsigned char dt2p; /* 51 DRAM Case Temperature Rise from Ambient 136 due to Precharge Power-Down (DT2P) */ 137 unsigned char dt3n; /* 52 DRAM Case Temperature Rise from Ambient 138 due to Active Standby (DT3N) */ 139 unsigned char dt3pfast; /* 53 DRAM Case Temperature Rise from Ambient 140 due to Active Power-Down with 141 Fast PDN Exit (DT3Pfast) */ 142 unsigned char dt3pslow; /* 54 DRAM Case Temperature Rise from Ambient 143 due to Active Power-Down with Slow 144 PDN Exit (DT3Pslow) */ 145 unsigned char dt4r_dt4r4w; /* 55 DRAM Case Temperature Rise from Ambient 146 due to Page Open Burst Read/DT4R4W 147 Mode Bit (DT4R/DT4R4W Mode Bit) */ 148 unsigned char dt5b; /* 56 DRAM Case Temperature Rise from Ambient 149 due to Burst Refresh (DT5B) */ 150 unsigned char dt7; /* 57 DRAM Case Temperature Rise from Ambient 151 due to Bank Interleave Reads with 152 Auto-Precharge (DT7) */ 153 unsigned char psi_ta_pll; /* 58 Thermal Resistance of PLL Package form 154 Top (Case) to Ambient (Psi T-A PLL) */ 155 unsigned char psi_ta_reg; /* 59 Thermal Reisitance of Register Package 156 from Top (Case) to Ambient 157 (Psi T-A Register) */ 158 unsigned char dtpllactive; /* 60 PLL Case Temperature Rise from Ambient 159 due to PLL Active (DT PLL Active) */ 160 unsigned char dtregact; /* 61 Register Case Temperature Rise from 161 Ambient due to Register Active/Mode Bit 162 (DT Register Active/Mode Bit) */ 163 unsigned char spd_rev; /* 62 SPD Data Revision Code */ 164 unsigned char cksum; /* 63 Checksum for bytes 0-62 */ 165 unsigned char mid[8]; /* 64 Mfr's JEDEC ID code per JEP-106 */ 166 unsigned char mloc; /* 72 Manufacturing Location */ 167 unsigned char mpart[18]; /* 73 Manufacturer's Part Number */ 168 unsigned char rev[2]; /* 91 Revision Code */ 169 unsigned char mdate[2]; /* 93 Manufacturing Date */ 170 unsigned char sernum[4]; /* 95 Assembly Serial Number */ 171 unsigned char mspec[27]; /* 99-127 Manufacturer Specific Data */ 172 173} ddr2_spd_eeprom_t; 174 175typedef struct ddr3_spd_eeprom_s { 176 /* General Section: Bytes 0-59 */ 177 unsigned char info_size_crc; /* 0 # bytes written into serial memory, 178 CRC coverage */ 179 unsigned char spd_rev; /* 1 Total # bytes of SPD mem device */ 180 unsigned char mem_type; /* 2 Key Byte / Fundamental mem type */ 181 unsigned char module_type; /* 3 Key Byte / Module Type */ 182 unsigned char density_banks; /* 4 SDRAM Density and Banks */ 183 unsigned char addressing; /* 5 SDRAM Addressing */ 184 unsigned char module_vdd; /* 6 Module nominal voltage, VDD */ 185 unsigned char organization; /* 7 Module Organization */ 186 unsigned char bus_width; /* 8 Module Memory Bus Width */ 187 unsigned char ftb_div; /* 9 Fine Timebase (FTB) 188 Dividend / Divisor */ 189 unsigned char mtb_dividend; /* 10 Medium Timebase (MTB) Dividend */ 190 unsigned char mtb_divisor; /* 11 Medium Timebase (MTB) Divisor */ 191 unsigned char tck_min; /* 12 SDRAM Minimum Cycle Time */ 192 unsigned char res_13; /* 13 Reserved */ 193 unsigned char caslat_lsb; /* 14 CAS Latencies Supported, 194 Least Significant Byte */ 195 unsigned char caslat_msb; /* 15 CAS Latencies Supported, 196 Most Significant Byte */ 197 unsigned char taa_min; /* 16 Min CAS Latency Time */ 198 unsigned char twr_min; /* 17 Min Write REcovery Time */ 199 unsigned char trcd_min; /* 18 Min RAS# to CAS# Delay Time */ 200 unsigned char trrd_min; /* 19 Min Row Active to 201 Row Active Delay Time */ 202 unsigned char trp_min; /* 20 Min Row Precharge Delay Time */ 203 unsigned char tras_trc_ext; /* 21 Upper Nibbles for tRAS and tRC */ 204 unsigned char tras_min_lsb; /* 22 Min Active to Precharge 205 Delay Time */ 206 unsigned char trc_min_lsb; /* 23 Min Active to Active/Refresh 207 Delay Time, LSB */ 208 unsigned char trfc_min_lsb; /* 24 Min Refresh Recovery Delay Time */ 209 unsigned char trfc_min_msb; /* 25 Min Refresh Recovery Delay Time */ 210 unsigned char twtr_min; /* 26 Min Internal Write to 211 Read Command Delay Time */ 212 unsigned char trtp_min; /* 27 Min Internal Read to Precharge 213 Command Delay Time */ 214 unsigned char tfaw_msb; /* 28 Upper Nibble for tFAW */ 215 unsigned char tfaw_min; /* 29 Min Four Activate Window 216 Delay Time*/ 217 unsigned char opt_features; /* 30 SDRAM Optional Features */ 218 unsigned char therm_ref_opt; /* 31 SDRAM Thermal and Refresh Opts */ 219 unsigned char therm_sensor; /* 32 Module Thermal Sensor */ 220 unsigned char device_type; /* 33 SDRAM device type */ 221 int8_t fine_tck_min; /* 34 Fine offset for tCKmin */ 222 int8_t fine_taa_min; /* 35 Fine offset for tAAmin */ 223 int8_t fine_trcd_min; /* 36 Fine offset for tRCDmin */ 224 int8_t fine_trp_min; /* 37 Fine offset for tRPmin */ 225 int8_t fine_trc_min; /* 38 Fine offset for tRCmin */ 226 unsigned char res_39_59[21]; /* 39-59 Reserved, General Section */ 227 228 /* Module-Specific Section: Bytes 60-116 */ 229 union { 230 struct { 231 /* 60 (Unbuffered) Module Nominal Height */ 232 unsigned char mod_height; 233 /* 61 (Unbuffered) Module Maximum Thickness */ 234 unsigned char mod_thickness; 235 /* 62 (Unbuffered) Reference Raw Card Used */ 236 unsigned char ref_raw_card; 237 /* 63 (Unbuffered) Address Mapping from 238 Edge Connector to DRAM */ 239 unsigned char addr_mapping; 240 /* 64-116 (Unbuffered) Reserved */ 241 unsigned char res_64_116[53]; 242 } unbuffered; 243 struct { 244 /* 60 (Registered) Module Nominal Height */ 245 unsigned char mod_height; 246 /* 61 (Registered) Module Maximum Thickness */ 247 unsigned char mod_thickness; 248 /* 62 (Registered) Reference Raw Card Used */ 249 unsigned char ref_raw_card; 250 /* 63 DIMM Module Attributes */ 251 unsigned char modu_attr; 252 /* 64 RDIMM Thermal Heat Spreader Solution */ 253 unsigned char thermal; 254 /* 65 Register Manufacturer ID Code, Least Significant Byte */ 255 unsigned char reg_id_lo; 256 /* 66 Register Manufacturer ID Code, Most Significant Byte */ 257 unsigned char reg_id_hi; 258 /* 67 Register Revision Number */ 259 unsigned char reg_rev; 260 /* 68 Register Type */ 261 unsigned char reg_type; 262 /* 69-76 RC1,3,5...15 (MS Nibble) / RC0,2,4...14 (LS Nibble) */ 263 unsigned char rcw[8]; 264 } registered; 265 unsigned char uc[57]; /* 60-116 Module-Specific Section */ 266 } mod_section; 267 268 /* Unique Module ID: Bytes 117-125 */ 269 unsigned char mmid_lsb; /* 117 Module MfgID Code LSB - JEP-106 */ 270 unsigned char mmid_msb; /* 118 Module MfgID Code MSB - JEP-106 */ 271 unsigned char mloc; /* 119 Mfg Location */ 272 unsigned char mdate[2]; /* 120-121 Mfg Date */ 273 unsigned char sernum[4]; /* 122-125 Module Serial Number */ 274 275 /* CRC: Bytes 126-127 */ 276 unsigned char crc[2]; /* 126-127 SPD CRC */ 277 278 /* Other Manufacturer Fields and User Space: Bytes 128-255 */ 279 unsigned char mpart[18]; /* 128-145 Mfg's Module Part Number */ 280 unsigned char mrev[2]; /* 146-147 Module Revision Code */ 281 282 unsigned char dmid_lsb; /* 148 DRAM MfgID Code LSB - JEP-106 */ 283 unsigned char dmid_msb; /* 149 DRAM MfgID Code MSB - JEP-106 */ 284 285 unsigned char msd[26]; /* 150-175 Mfg's Specific Data */ 286 unsigned char cust[80]; /* 176-255 Open for Customer Use */ 287 288} ddr3_spd_eeprom_t; 289 290/* From JEEC Standard No. 21-C release 23A */ 291struct ddr4_spd_eeprom_s { 292 /* General Section: Bytes 0-127 */ 293 uint8_t info_size_crc; /* 0 # bytes */ 294 uint8_t spd_rev; /* 1 Total # bytes of SPD */ 295 uint8_t mem_type; /* 2 Key Byte / mem type */ 296 uint8_t module_type; /* 3 Key Byte / Module Type */ 297 uint8_t density_banks; /* 4 Density and Banks */ 298 uint8_t addressing; /* 5 Addressing */ 299 uint8_t package_type; /* 6 Package type */ 300 uint8_t opt_feature; /* 7 Optional features */ 301 uint8_t thermal_ref; /* 8 Thermal and refresh */ 302 uint8_t oth_opt_features; /* 9 Other optional features */ 303 uint8_t res_10; /* 10 Reserved */ 304 uint8_t module_vdd; /* 11 Module nominal voltage */ 305 uint8_t organization; /* 12 Module Organization */ 306 uint8_t bus_width; /* 13 Module Memory Bus Width */ 307 uint8_t therm_sensor; /* 14 Module Thermal Sensor */ 308 uint8_t ext_type; /* 15 Extended module type */ 309 uint8_t res_16; 310 uint8_t timebases; /* 17 MTb and FTB */ 311 uint8_t tck_min; /* 18 tCKAVGmin */ 312 uint8_t tck_max; /* 19 TCKAVGmax */ 313 uint8_t caslat_b1; /* 20 CAS latencies, 1st byte */ 314 uint8_t caslat_b2; /* 21 CAS latencies, 2nd byte */ 315 uint8_t caslat_b3; /* 22 CAS latencies, 3rd byte */ 316 uint8_t caslat_b4; /* 23 CAS latencies, 4th byte */ 317 uint8_t taa_min; /* 24 Min CAS Latency Time */ 318 uint8_t trcd_min; /* 25 Min RAS# to CAS# Delay Time */ 319 uint8_t trp_min; /* 26 Min Row Precharge Delay Time */ 320 uint8_t tras_trc_ext; /* 27 Upper Nibbles for tRAS and tRC */ 321 uint8_t tras_min_lsb; /* 28 tRASmin, lsb */ 322 uint8_t trc_min_lsb; /* 29 tRCmin, lsb */ 323 uint8_t trfc1_min_lsb; /* 30 Min Refresh Recovery Delay Time */ 324 uint8_t trfc1_min_msb; /* 31 Min Refresh Recovery Delay Time */ 325 uint8_t trfc2_min_lsb; /* 32 Min Refresh Recovery Delay Time */ 326 uint8_t trfc2_min_msb; /* 33 Min Refresh Recovery Delay Time */ 327 uint8_t trfc4_min_lsb; /* 34 Min Refresh Recovery Delay Time */ 328 uint8_t trfc4_min_msb; /* 35 Min Refresh Recovery Delay Time */ 329 uint8_t tfaw_msb; /* 36 Upper Nibble for tFAW */ 330 uint8_t tfaw_min; /* 37 tFAW, lsb */ 331 uint8_t trrds_min; /* 38 tRRD_Smin, MTB */ 332 uint8_t trrdl_min; /* 39 tRRD_Lmin, MTB */ 333 uint8_t tccdl_min; /* 40 tCCS_Lmin, MTB */ 334 uint8_t res_41[60-41]; /* 41 Rserved */ 335 uint8_t mapping[78-60]; /* 60~77 Connector to SDRAM bit map */ 336 uint8_t res_78[117-78]; /* 78~116, Reserved */ 337 int8_t fine_tccdl_min; /* 117 Fine offset for tCCD_Lmin */ 338 int8_t fine_trrdl_min; /* 118 Fine offset for tRRD_Lmin */ 339 int8_t fine_trrds_min; /* 119 Fine offset for tRRD_Smin */ 340 int8_t fine_trc_min; /* 120 Fine offset for tRCmin */ 341 int8_t fine_trp_min; /* 121 Fine offset for tRPmin */ 342 int8_t fine_trcd_min; /* 122 Fine offset for tRCDmin */ 343 int8_t fine_taa_min; /* 123 Fine offset for tAAmin */ 344 int8_t fine_tck_max; /* 124 Fine offset for tCKAVGmax */ 345 int8_t fine_tck_min; /* 125 Fine offset for tCKAVGmin */ 346 /* CRC: Bytes 126-127 */ 347 uint8_t crc[2]; /* 126-127 SPD CRC */ 348 349 /* Module-Specific Section: Bytes 128-255 */ 350 union { 351 struct { 352 /* 128 (Unbuffered) Module Nominal Height */ 353 uint8_t mod_height; 354 /* 129 (Unbuffered) Module Maximum Thickness */ 355 uint8_t mod_thickness; 356 /* 130 (Unbuffered) Reference Raw Card Used */ 357 uint8_t ref_raw_card; 358 /* 131 (Unbuffered) Address Mapping from 359 Edge Connector to DRAM */ 360 uint8_t addr_mapping; 361 /* 132~253 (Unbuffered) Reserved */ 362 uint8_t res_132[254-132]; 363 /* 254~255 CRC */ 364 uint8_t crc[2]; 365 } unbuffered; 366 struct { 367 /* 128 (Registered) Module Nominal Height */ 368 uint8_t mod_height; 369 /* 129 (Registered) Module Maximum Thickness */ 370 uint8_t mod_thickness; 371 /* 130 (Registered) Reference Raw Card Used */ 372 uint8_t ref_raw_card; 373 /* 131 DIMM Module Attributes */ 374 uint8_t modu_attr; 375 /* 132 RDIMM Thermal Heat Spreader Solution */ 376 uint8_t thermal; 377 /* 133 Register Manufacturer ID Code, LSB */ 378 uint8_t reg_id_lo; 379 /* 134 Register Manufacturer ID Code, MSB */ 380 uint8_t reg_id_hi; 381 /* 135 Register Revision Number */ 382 uint8_t reg_rev; 383 /* 136 Address mapping from register to DRAM */ 384 u8 reg_map; 385 u8 ca_stren; 386 u8 clk_stren; 387 /* 139~253 Reserved */ 388 u8 res_137[254 - 139]; 389 /* 254~255 CRC */ 390 uint8_t crc[2]; 391 } registered; 392 struct { 393 /* 128 (Loadreduced) Module Nominal Height */ 394 uint8_t mod_height; 395 /* 129 (Loadreduced) Module Maximum Thickness */ 396 uint8_t mod_thickness; 397 /* 130 (Loadreduced) Reference Raw Card Used */ 398 uint8_t ref_raw_card; 399 /* 131 DIMM Module Attributes */ 400 uint8_t modu_attr; 401 /* 132 RDIMM Thermal Heat Spreader Solution */ 402 uint8_t thermal; 403 /* 133 Register Manufacturer ID Code, LSB */ 404 uint8_t reg_id_lo; 405 /* 134 Register Manufacturer ID Code, MSB */ 406 uint8_t reg_id_hi; 407 /* 135 Register Revision Number */ 408 uint8_t reg_rev; 409 /* 136 Address mapping from register to DRAM */ 410 uint8_t reg_map; 411 /* 137 Register Output Drive Strength for CMD/Add*/ 412 uint8_t reg_drv; 413 /* 138 Register Output Drive Strength for CK */ 414 uint8_t reg_drv_ck; 415 /* 139 Data Buffer Revision Number */ 416 uint8_t data_buf_rev; 417 /* 140 DRAM VrefDQ for Package Rank 0 */ 418 uint8_t vrefqe_r0; 419 /* 141 DRAM VrefDQ for Package Rank 1 */ 420 uint8_t vrefqe_r1; 421 /* 142 DRAM VrefDQ for Package Rank 2 */ 422 uint8_t vrefqe_r2; 423 /* 143 DRAM VrefDQ for Package Rank 3 */ 424 uint8_t vrefqe_r3; 425 /* 144 Data Buffer VrefDQ for DRAM Interface */ 426 uint8_t data_intf; 427 /* 428 * 145 Data Buffer MDQ Drive Strength and RTT 429 * for data rate <= 1866 430 */ 431 uint8_t data_drv_1866; 432 /* 433 * 146 Data Buffer MDQ Drive Strength and RTT 434 * for 1866 < data rate <= 2400 435 */ 436 uint8_t data_drv_2400; 437 /* 438 * 147 Data Buffer MDQ Drive Strength and RTT 439 * for 2400 < data rate <= 3200 440 */ 441 uint8_t data_drv_3200; 442 /* 148 DRAM Drive Strength */ 443 uint8_t dram_drv; 444 /* 445 * 149 DRAM ODT (RTT_WR, RTT_NOM) 446 * for data rate <= 1866 447 */ 448 uint8_t dram_odt_1866; 449 /* 450 * 150 DRAM ODT (RTT_WR, RTT_NOM) 451 * for 1866 < data rate <= 2400 452 */ 453 uint8_t dram_odt_2400; 454 /* 455 * 151 DRAM ODT (RTT_WR, RTT_NOM) 456 * for 2400 < data rate <= 3200 457 */ 458 uint8_t dram_odt_3200; 459 /* 460 * 152 DRAM ODT (RTT_PARK) 461 * for data rate <= 1866 462 */ 463 uint8_t dram_odt_park_1866; 464 /* 465 * 153 DRAM ODT (RTT_PARK) 466 * for 1866 < data rate <= 2400 467 */ 468 uint8_t dram_odt_park_2400; 469 /* 470 * 154 DRAM ODT (RTT_PARK) 471 * for 2400 < data rate <= 3200 472 */ 473 uint8_t dram_odt_park_3200; 474 uint8_t res_155[254-155]; /* Reserved */ 475 /* 254~255 CRC */ 476 uint8_t crc[2]; 477 } loadreduced; 478 uint8_t uc[128]; /* 128-255 Module-Specific Section */ 479 } mod_section; 480 481 uint8_t res_256[320-256]; /* 256~319 Reserved */ 482 483 /* Module supplier's data: Byte 320~383 */ 484 uint8_t mmid_lsb; /* 320 Module MfgID Code LSB */ 485 uint8_t mmid_msb; /* 321 Module MfgID Code MSB */ 486 uint8_t mloc; /* 322 Mfg Location */ 487 uint8_t mdate[2]; /* 323~324 Mfg Date */ 488 uint8_t sernum[4]; /* 325~328 Module Serial Number */ 489 uint8_t mpart[20]; /* 329~348 Mfg's Module Part Number */ 490 uint8_t mrev; /* 349 Module Revision Code */ 491 uint8_t dmid_lsb; /* 350 DRAM MfgID Code LSB */ 492 uint8_t dmid_msb; /* 351 DRAM MfgID Code MSB */ 493 uint8_t stepping; /* 352 DRAM stepping */ 494 uint8_t msd[29]; /* 353~381 Mfg's Specific Data */ 495 uint8_t res_382[2]; /* 382~383 Reserved */ 496 497 uint8_t user[512-384]; /* 384~511 End User Programmable */ 498}; 499 500extern unsigned int ddr1_spd_check(const ddr1_spd_eeprom_t *spd); 501extern void ddr1_spd_dump(const ddr1_spd_eeprom_t *spd); 502extern unsigned int ddr2_spd_check(const ddr2_spd_eeprom_t *spd); 503extern void ddr2_spd_dump(const ddr2_spd_eeprom_t *spd); 504extern unsigned int ddr3_spd_check(const ddr3_spd_eeprom_t *spd); 505unsigned int ddr4_spd_check(const struct ddr4_spd_eeprom_s *spd); 506 507/* 508 * Byte 2 Fundamental Memory Types. 509 */ 510#define SPD_MEMTYPE_FPM (0x01) 511#define SPD_MEMTYPE_EDO (0x02) 512#define SPD_MEMTYPE_PIPE_NIBBLE (0x03) 513#define SPD_MEMTYPE_SDRAM (0x04) 514#define SPD_MEMTYPE_ROM (0x05) 515#define SPD_MEMTYPE_SGRAM (0x06) 516#define SPD_MEMTYPE_DDR (0x07) 517#define SPD_MEMTYPE_DDR2 (0x08) 518#define SPD_MEMTYPE_DDR2_FBDIMM (0x09) 519#define SPD_MEMTYPE_DDR2_FBDIMM_PROBE (0x0A) 520#define SPD_MEMTYPE_DDR3 (0x0B) 521#define SPD_MEMTYPE_DDR4 (0x0C) 522 523/* DIMM Type for DDR2 SPD (according to v1.3) */ 524#define DDR2_SPD_DIMMTYPE_UNDEFINED (0x00) 525#define DDR2_SPD_DIMMTYPE_RDIMM (0x01) 526#define DDR2_SPD_DIMMTYPE_UDIMM (0x02) 527#define DDR2_SPD_DIMMTYPE_SO_DIMM (0x04) 528#define DDR2_SPD_DIMMTYPE_72B_SO_CDIMM (0x06) 529#define DDR2_SPD_DIMMTYPE_72B_SO_RDIMM (0x07) 530#define DDR2_SPD_DIMMTYPE_MICRO_DIMM (0x08) 531#define DDR2_SPD_DIMMTYPE_MINI_RDIMM (0x10) 532#define DDR2_SPD_DIMMTYPE_MINI_UDIMM (0x20) 533 534/* Byte 3 Key Byte / Module Type for DDR3 SPD */ 535#define DDR3_SPD_MODULETYPE_MASK (0x0f) 536#define DDR3_SPD_MODULETYPE_RDIMM (0x01) 537#define DDR3_SPD_MODULETYPE_UDIMM (0x02) 538#define DDR3_SPD_MODULETYPE_SO_DIMM (0x03) 539#define DDR3_SPD_MODULETYPE_MICRO_DIMM (0x04) 540#define DDR3_SPD_MODULETYPE_MINI_RDIMM (0x05) 541#define DDR3_SPD_MODULETYPE_MINI_UDIMM (0x06) 542#define DDR3_SPD_MODULETYPE_MINI_CDIMM (0x07) 543#define DDR3_SPD_MODULETYPE_72B_SO_UDIMM (0x08) 544#define DDR3_SPD_MODULETYPE_72B_SO_RDIMM (0x09) 545#define DDR3_SPD_MODULETYPE_72B_SO_CDIMM (0x0A) 546#define DDR3_SPD_MODULETYPE_LRDIMM (0x0B) 547#define DDR3_SPD_MODULETYPE_16B_SO_DIMM (0x0C) 548#define DDR3_SPD_MODULETYPE_32B_SO_DIMM (0x0D) 549 550/* DIMM Type for DDR4 SPD */ 551#define DDR4_SPD_MODULETYPE_MASK (0x0f) 552#define DDR4_SPD_MODULETYPE_EXT (0x00) 553#define DDR4_SPD_MODULETYPE_RDIMM (0x01) 554#define DDR4_SPD_MODULETYPE_UDIMM (0x02) 555#define DDR4_SPD_MODULETYPE_SO_DIMM (0x03) 556#define DDR4_SPD_MODULETYPE_LRDIMM (0x04) 557#define DDR4_SPD_MODULETYPE_MINI_RDIMM (0x05) 558#define DDR4_SPD_MODULETYPE_MINI_UDIMM (0x06) 559#define DDR4_SPD_MODULETYPE_72B_SO_UDIMM (0x08) 560#define DDR4_SPD_MODULETYPE_72B_SO_RDIMM (0x09) 561#define DDR4_SPD_MODULETYPE_16B_SO_DIMM (0x0C) 562#define DDR4_SPD_MODULETYPE_32B_SO_DIMM (0x0D) 563 564#endif /* _DDR_SPD_H_ */ 565